• High packing density and transmission rates up to 400G

Description

Cloud computing places special demands on data centre cabling. In view of huge amounts of data, network components must meet high requirements regarding high availability and reliability. tde - trans data elektronik and its cooperation partner Senko are helping companies to successfully test their digitization projects, develop efficient cloud strategies and validate use cases. To this end, the network expert has implemented structured cabling in the central distributor and in selected manufacturer's cabinets based on its pre-terminated plug-and-play tML® 24 and tML® 32 cabling systems as well as the patch cable management system tPM.

Customer values/problems solved:

  • Very clean and space saving installation
  • Particularly easy handling
  • High packing density with up to 3.072 fibres on one height unit in combination with tML® 24 and tML® 32
  • Future-proof and investment-safe migration options up to currently 400G and more
  • Packing density can be significantly increased and the cable volume can be reduced
  • Green IT due to more efficient ventilation of the server rack as well as orderly and flexible routing of fibre optic and TP patch cables in the network distributor thanks to patch cable management tPM

Technologies

  • tML® 32 – tde Modular Link System
  • tML® 24 – tde Modular Link System
  • tPM – tde Patch Cable Management
  • CS® Connectors (Senko)

Partners

Partners: